摘要
本文从集成电路产业的产业链、创新链与资金链融合理论依据层面,产业链与创新链的融合机制以及产业链、创新链与资金链的融合机制进行分析,以复合系统协同度模型测算2009—2020年集成电路产业“三链”的协同度。实证结果显示,集成电路产业“三链”融合度较低,直到2018年才呈正向上升趋势,主要是由于产业链和创新链有序度波动的影响。从“三链”子系统序参量的变化趋势看,专有权转让合同数、销售利率、芯片半导体行业获融资额、集成电路制造企业数量、技术融合指标对“三链”融合度具有较大影响。为此,应采取以下措施:建立与集成电路产业“三链”融合相适应的科技财政体制;建立集成电路产业全产业链的创新减税和抵扣政策;形成与集成电路产业匹配的科技金融体系,促进资金链全覆盖;建立多层次人才体系,提升创新链整体能力;加强集成电路核心技术突破的统筹协调机构建设,构建完善的国内市场支持体系,着力提升“三链”融合度。
The integrated development of“three chains”is the key to realizing the innovation and breakthrough of the industry and the optimization of the industrial structure in the integrated circuit industry.Firstly,it analyzes the theoretical basis of“three chains”integration of the IC industry,the integration mechanism of the industry chain and the innovation chain,the integration mechanism of the industry chain,the innovation chain and the capital chain.The synergy of“three chains”in 2009—2020 is calculated by using a composite system synergy model.The empirical results show that the integration degree of“three chains”of China s integrated circuit industry is relatively low until 2018,and the upward trend is mainly due to the influence of the fluctuation of the orderly degree of the industrial chain and the innovation chain.Judging from the changing trend of the sequence parameters of“three-chain”subsystem,the number of exclusive rights transfer contracts,the sales rate,the amount of financing received in the chip semiconductor industry,the number of integrated circuit manufacturing companies,and the technical integration indicators have a greater impact on“three-chain”degree.Therefore,A science and technology financial system that is compatible with the integration of“three chains”of the integrated circuit industry should be established;Innovative tax reduction and deduction policies for the entire industry chain of the integrated circuit industry should be established;A technology financial system that matches the integrated circuit industry should be formed,and the funding chain should be fully covered;A multi-level talent system for enhancing the overall capability of the innovation chain should be established;the construction of an overall coordination institution for breakthroughs in integrated circuit core technologies should be strengthened,and a complete domestic market support system for improving the integration of the“three chains”should be built.
作者
孙琴
刘戒骄
Sun Qin;Liu Jiejiao(School of Applied Economics,University of Chinese Academy of Social Sciences,Beijing 102488,China;Business School,Jiangxi Institute of Fashion Technology,Nanchang 330201,China;Institute of Industrial Economics of Chinese Academy of Social Science,Beijing 100006,China;Institute of Industrial Economics of CASS,Beijing 100006,China)
出处
《中国科技论坛》
CSSCI
北大核心
2023年第7期63-73,共11页
Forum on Science and Technology in China
基金
中国社会科学院国家高端智库基础研究项目(22ZKJC019)
国家社会科学基金重大项目“中国式创新的综合优势、模式演进及体制机制的经济学研究”(22&ZD052)。
关键词
集成电路
“三链”融合
复合系统协同度模型
Integrated circuit
“Three chains”integration
Composite system synergy model
