摘要
为突破传统功率半导体器件的封装和应用结构限制,实现变流装备的升级换代,文章提出了一种新型的高功率密度智能化集成功率器件。为验证该技术路线的可行性,以大功率变流领域内常见的并联应用场景作为研究对象,从器件参数、主电路、散热结构、驱动控制等4个主要影响因素着手,分析并验证了其良好的器件匹配性、电感均衡度、散热均温性、控制信号同步性、抗干扰能力,最后通过双脉冲试验和功率考核试验,证明了其良好的并联均流效果。试验结果表明,该技术平台从理论设计到实物验证的目标可以得到实现,具备了工程应用基础。
To overcome the limitations on the packaging and application structure of traditional power semiconductor devices and upgrade converters,this paper proposed a novel intelligent integrated power device with high power density.Its feasibility was investigated by focusing on common parallel application scenarios in the high-power converter field.The study primarily examined the four key influencing factors:device parameters,main circuit,heat dissipation structure,and drive control.It analyzed and validated the excellent device matching,inductance balance,heat dissipation uniformity,control signal synchronization,and anti-interference capability.Subsequently,the article demonstrated the favorable parallel current sharing effect through the double pulse test and power assessment test.The experimental results show the achievement of the theoretical design and physical verification objectives of this technology platform,establishing a strong foundation for future engineering applications.
作者
金肩舸
杨进锋
王晓元
刘杰
宋郭蒙
马龙昌
JIN Jiange;YANG Jinfeng;WANG Xiaoyuan;LIU Jie;SONG Guomeng;MA Longchang(CRRC Zhuzhou Institute Co.,Ltd.,Zhuzhou,Hunan 412001,China)
出处
《机车电传动》
北大核心
2023年第4期145-151,共7页
Electric Drive for Locomotives
基金
国铁集团科技研究开发计划项目(K2021J046)
中国中车“十四五”科技重大专项(2021CTZ023-4)。
关键词
大功率
高压
集成化
智能化
IGBT
IPM
并联均流
high power
high voltage
integration
intelligent
IGBT
IPM
paralleled current sharing
