摘要
针对SoC芯片ATE性能测试进行了研究,分析芯片性能测试的关键参数和典型测试类型(内部模块性能测试和接口数据流性能测试)。基于这两种测试类型,以“Date Rate”性能测试为例,分别进行了测试方法的实现。内部模块性能测试的实现,通过指示信号输出性能测试开始和结束波形,采用逆向思维通过“ERCT”获取代表性能运行时间的“Fail Cycle”数,然后对性能时间进行计算来获得性能测试值。接口数据流性能测试的实现,主要通过“Digital Capture”捕获接口数据,然后对接口数据进行处理和计算来获得性能测试值。上述性能测试方法及原理,在ATE测试应用中具有通用性,对于相同或相似的基于时间参数的芯片性能测试具有参考作用。
The ATE performance test of SoC chip is studied.The key parameters and typical test types of chip performance test(internal module performance test and interface data flow performance test)are analyzed.Based on these two types of test,taking the performance test of“Date Rate”as an example,the test methods are implemented respectively.The realization of the internal module performance test is output the start and end waveforms of performance test by indicator signal,obtain the number of“Fail Cycle”representing the performance running time through“ERCT”in reverse thinking,and then calculate the performance time to obtain the performance test value.The implementation of interface data flow performance test mainly captures interface data through“Dignital Capture”,and then processes and calculates the interface data to obtain the performance test value.The above performance test methods and principles are universal in ATE test applications,and can be used as a reference for the same or similar chip performance test based on time parameters.
作者
唐丽
唐昱
邹映涛
TANG Li;TANG Yu;ZOU Yingtao(Chengdu Javee Microelectronics Co.,LTD.,Chengdu 610041,China)
出处
《电子质量》
2023年第9期15-20,共6页
Electronics Quality
