期刊文献+

Incoloy 825合金加热过程中晶粒长大行为研究

Research on the Grain Growth Behavior of Incoloy 825 Alloy During the Heating Process
原文传递
导出
摘要 研究了Incoloy 825合金在1223~1473 K温度范围内保温0~150 min后的晶粒长大行为,分析了加热温度和保温时间对其晶粒尺寸的影响,构建了Incoloy 825合金晶粒长大的数学模型。结果表明,当温度低于1373 K时,晶粒长大缓慢,晶粒尺寸变化不大;当温度高于1373 K时,合金晶粒尺寸明显长大。通过回归分析,构建了Incoloy 825合金两段式晶粒长大数学模型,能够较好地预测该合金在不同加热温度、不同保温时间下的晶粒尺寸。 It was studied the grain growth behavior of Incoloy 825 alloy within the temperature range from 1223 to 1473 K and holding time range from 0 to 150 min.The influence of the temperature and holding time on the grain size was analysed,and the evolution law of the grain size was studied.The results indicate that the grain size shows no remarkable growth with increasing temperature and holding time when the temperature is lower than 1373 K.However,the grain size grows obviously with increasing temperature and holding time when the heating temperature is above 1373 K.The two-stage grain growth model is established on the basis of regression analysis,which can well predict the grain size under different heating temperatures and holding time.
作者 寇金凤 白亚冠 聂义宏 张鑫 张冰冰 郭伟 李红梅 KOU Jinfeng;BAI Yaguan;NIE Yihong;ZHANG Xin;ZHANG Bingbing;GUO Wei;LI Hongmei(Tianjin Heavy Industries Research and Development Co.,Ltd.,Tianjin 300457,China;China First Heavy Machinery Co.,Ltd.,Qiqihaer 161042,China)
出处 《铸造技术》 CAS 2023年第10期941-947,共7页 Foundry Technology
基金 国家重点研发计划(2021YFB3704102)。
关键词 Incoloy 825 晶粒长大 数学模型 Incoloy 825 grain growth mathematical model
  • 相关文献

参考文献19

二级参考文献131

共引文献107

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部