摘要
在含有12 g/L Cu2+和100 g/L硫酸的粗化液中添加钼酸钠和钨酸钠作为复合添加剂,以降低电路板铜箔电解粗化后的表面粗糙度及提升其剥离强度。通过扫描电镜(SEM)分析、表面粗糙度测量、X射线衍射(XRD)表征、剥离强度测试及电阻检测,研究了钼酸钠单独使用及其与钨酸钠复合使用时对铜箔表面形貌、粗糙度、晶面结构及导电性的影响。结果表明,钼酸钠单独作为铜箔电解粗化的添加剂时,对铜箔的晶面结构和导电性影响不大,但能够显著提升铜箔的剥离强度。0.05 g/L钨酸钠与钼酸钠复合使用时,随着钼酸钠质量浓度的增大,铜箔表面从不规则的颗粒晶逐渐长成粗大的树枝晶,Rz(取样范围内微观5点的平均峰高)呈先上升后下降的趋势,Ra(取样范围内轮廓的算术平均值)呈先下降后上升再下降的趋势,剥离强度呈先增大后减小的变化趋势,晶面结构和导电性变化不大。较佳的复合添加剂组合为0.05 g/L钨酸钠+0.05 g/L钼酸钠。
Sodium molybdate and sodium tungstate were added to an electrolyte comprising 12 g/L Cu2+and 100 g/L sulfuric acid to reduce the surface roughness of copper foil used for manufacturing circuit board after being roughened and improve its peel strength.The effect of mass concentration of sodium molybdate when it was used alone or in combination with sodium tungstate on the surface morphology,surface roughness,crystalline structure,and conductivity of copper foil was studied by scanning electron microscopy(SEM),surface roughness measurement,X-ray diffraction(XRD),peel strength testing,and electrical resistance measurement.The results showed that the individual addition of sodium molybdate had little effect on the crystal structure and conductivity of copper foil,but greatly improved its peel strength.When combined with 0.05 mg/L of sodium tungstate,the morphology of copper foil gradually transferred from irregular granular crystals into coarse dendrites with the increasing of the dosage of sodium molybdate,the peel strength and Rz(mean peak height of five micro-points in the sampling area)were increased initially and then decreased,the Ra(arithmetical mean deviation of profiles in the sampling area)was decreased initially and then increased and finally decreased again,and the crystal structure and conductivity were changed slightly.The optimal composition of the composite additive was determined as follows:0.05 g/L sodium molybdate+0.05 g/L sodium tungstate.
作者
冯宝鑫
张杰
白忠波
彭肖林
任伟伟
蔡辉
张菁丽
刘二勇
FENG Baoxin;ZHANG Jie;BAI Zhongbo;PENG Xiaolin;REN Weiwei;CAI Hui;ZHANG Jingli;LIU Eryong(Lingbao Huaxin Copper Foil Co.,Ltd.,Lingbao 472599,China;Nanjing Longdian Huaxin New Energy Materials Industry Tec;hnology Research Institute Co.,Ltd.,Nanjing 211200,China3.College of Materials Science and Engineering,Xi’an University of Science and Technology,Xi’an 710054,China)
出处
《电镀与涂饰》
CAS
北大核心
2023年第19期74-82,共9页
Electroplating & Finishing
基金
国家自然科学基金(52175184)
陕西省重点研发计划项目(2021SF-469)。
关键词
铜箔
电解粗化
钼酸钠
钨酸钠
剥离强度
组织结构
copper foil
electrolytic roughening
sodium molybdate
sodium tungstate
peel strength
microstructure
