摘要
介绍了一种半导体晶圆扩晶机装置的设计方案,并阐述了扩晶机构、切刀机构、圆台机构和视觉系统的设计。测试结果表明,该装置可以满足半导体晶圆扩晶的工艺要求,目前已经在MiniLED芯片封装测试企业成功使用。
A design solution is illustrated for semiconductor expanding machine in this paper,and the expanding mechanical structure,cutting structure,round table structure and vision system design are also illustrated.The test result shows the machine satisfy the requirement of semiconductor wafer expanding,and this machine is currently already adopted in MiniLED chip package and test company.
作者
郑嘉瑞
张浩
ZHENG Jiarui;ZHANG Hao(Shenzhen Liande Automation Equipment Co.,Ltd.,Shenzhen 518109,China)
出处
《电子工业专用设备》
2023年第5期46-49,共4页
Equipment for Electronic Products Manufacturing
关键词
半导体
扩晶
芯片
Semiconductor
Expanding
Chip
