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射频微系统关键技术进展及展望

Progress and Prospects of Key Technologies in RF Microsystems
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摘要 文章简单介绍了微波集成电路的发展动态,综述了以美国DARPA为代表的国内外机构在射频微系统方面的重大研究计划及其水平,简述了射频微系统在通信、雷达、相控阵等领域的代表性应用,并总结了射频微系统互连、仿真与优化和集成架构设计等三个关键技术及其进展情况,最后对射频微系统今后的发展趋势做出了展望。 This paper briefly introduces the development of microwave integrated circuits,summarizes the major research projects and levels of domestic and foreign institutions represented by DARPA USA in RF microsystems,and briefly describes the representative applications of RF microsystems in communication,radar,phased array and other fields.Three key technologies of RF microsystem interconnection,simulation and optimization,integrated architecture design and their progress are summarized.Finally,the future development trend of RF microsystem is prospected.
作者 徐锐敏 王欢鹏 徐跃杭 XU Rui-min;WANG Huan-peng;XU Yue-hang(School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China)
机构地区 电子科技大学电子科学与工程学院
出处 《微波学报》 CSCD 北大核心 2023年第5期70-78,共9页 Journal of Microwaves
基金 国家自然科学基金(62131014)。
关键词 射频微系统 三维集成互连 多物理场仿真 三维集成架构 RF microsystems 3D integration interconnection multiphysics-fields simulation 3D integrated architecture
分类号 TN454 [电子电信—微电子学与固体电子学]
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微波学报
2023年 第5期

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