摘要
随着电子产品不断向微型化、集成化发展,基于硅通孔(TSV)的2.5D和3D封装等先进封装技术被广泛应用于微系统集成.然而,数量众多的微米级焊点和毫米级管壳封装使得微系统结构呈现多尺度特征,极大增加了仿真分析难度、降低了计算效率,亟需通过微焊点层的等效力学参数均匀化计算以建立简化模型减少计算量.采用理论分析与有限元仿真两种方法分别计算微焊点层等效力学参数,并对比分析两种方法计算结果差异.最后,结合有限元方法计算值,提出了一种改进等效力学参数均匀化计算方法,高效且精确给出微焊点层等效力学参数,为微系统封装结构的仿真分析评估提供技术支撑.
With the development of miniaturization and integration of electronic products,2.5D packaging and 3D packaging based on Through-Silicon Vias(TSV)has been widely used in microsystem integration.The microsystem structures with a large number of micron-scale bumps and millimeter-scale packaging exhibit multi-scale characteristics,increasing the difficulty of simulation analysis and reducing the computational efficiency.In order to improve the computational efficiency and accuracy,the homogenization method for equivalent mechanical properties is essential.Analytical model and finite element model were established to calculate the equivalent mechanical properties of microbump layers in this paper.Based on contrastive analysis of prediction result,a homogenization method for equivalent mechanical properties was proposed in this paper,which combined the advantage of these two method,efficiently and accurately provided equivalent mechanical parameters of the microbump layer,and provided a technical support for the simulation analysis and evaluation of the microsystem packaging structure.
作者
李逵
邢睿思
匡乃亮
杨宇军
王超
张跃平
高武
LI Kui;XING Ruisi;KUANG Nailiang;YANG Yujun;WANG Chao;ZHANG Yueping;GAO Wu(Xi’an Institute of Microelectronics Technology,Xi’an 710054,China;School of Computer Science,Northwestern Polytechnical University,Xi’an 710072,China;Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)
出处
《微电子学与计算机》
2023年第11期112-120,共9页
Microelectronics & Computer
关键词
微系统
微焊点
结构多尺度
均匀化方法
microsystem
microbump layer
multi-scale structure
homogenization method
