摘要
陶瓷基板微系统T/R组件具有体积小、密度高、轻量化等特点,正在逐步取代传统微组装砖式T/R组件。在微系统封装新技术路线的引领下,T/R组件对于微电子焊接技术的需求发生了较大变化。针对基于陶瓷基板微系统T/R组件的微电子焊接技术展开了论述,重点阐述了新技术路线与传统技术路线对于技术需求的差异,对围框钎焊、焊球/焊柱钎焊、基板与器件钎焊、高密度键合及盖板气密封焊等关键技术进行了介绍,归纳并总结了近年来相关技术领域的研究现状,并给出了现有技术水平条件下满足高可靠、低成本封装需求的最优工艺方法,为微电子焊接技术的发展提供了参考。
Ceramic substrate micro-system T/R components have the characteristics of small volume,high density and light weight,which are gradually replacing the traditional micro-assembly brick-type T/R components.Under the leadership of new system of micro-system packaging,the demand for microelectronic welding technology in T/R components has changed considerably.The microelectronic welding technology based on ceramic substrate micro-system T/R components is discussed,the discussion focuses on the differences between the new technology route and the traditional technology route for the technical requirements.Key technologies such as frame brazing,welding ball/pillar brazing,substrate and the device brazing,high-density bonding and cover plate gas sealing welding are introduced.The research status in relevant technical fields in recent years is summarized,and the optimal process method to meet the requirements of high reliability and low cost packaging under the current technological level conditions is provided,providing a reference for the development of microelectronic welding technology.
作者
王禾
周健
戴岚
张丽
WANG He;ZHOU Jian;DAI Lan;ZHANG Li(China Electronics Technology Group Corporation No.38 Research Institute,Hefei 230031,China;School of Materials Science and Engineering,Southeast University,Nanjing 211189,China)
出处
《电子与封装》
2023年第11期39-46,共8页
Electronics & Packaging
关键词
微电子焊接
陶瓷基板
T/R组件
microelectronic welding
ceramic substrate
T/R components
