摘要
随着人工智能(AI)和集成电路的飞速发展,人工智能芯片逐渐成为全球科技竞争的焦点。在后摩尔时代,AI芯片的算力提升和功耗降低越来越依靠具有硅通孔、微凸点、异构集成、Chiplet等技术特点的先进封装技术。从AI芯片的分类与特点出发,对国内外典型先进封装技术进行分类与总结,在此基础上,对先进封装结构可靠性以及封装散热等方面面临的挑战进行总结并提出相应解决措施。面向AI应用,对先进封装技术的未来发展进行展望。
With the rapid development of artificial intelligence(AI)and integrated circuits,artificial intelligence chips have become the focus of global science and technology competition.In the post-Moore era,the computing power enhancement and power dissipation reduction of AI chips increasingly rely on advanced packaging technologies with characteristics such as TSV,micro-bump,heterogeneous integration and Chiplet.Starting from the classification and characteristics of AI chips,the typical advanced packaging technologies at home and abroad are classified and summarized.On this basis,the challenges faced by advanced packaging structure reliability and packaging heat dissipation are summarized and corresponding solutions are proposed.The future development of advanced packaging technology is prospected for AI applications.
作者
田文超
谢昊伦
陈源明
赵静榕
张国光
TIAN Wenchao;XIE Haolun;CHEN Yuanming;ZHAO Jingrong;ZHANG Guoguang(School of Mechano-Electronic Engineering,Xidian University,Xi’an 710071,China;School of Hangzhou Research Institute,Xidian University,Hangzhou 311231,China;Shanghai Sharetek Technology Co.,Ltd.,Shanghai 201109,China;Foshan Blue Rocket Electronics Co.,Ltd.,Foshan 528051,China)
出处
《电子与封装》
2024年第1期17-29,共13页
Electronics & Packaging
关键词
人工智能芯片
先进封装
可靠性
封装散热
artificial intelligence chips
advanced packaging
reliability
packaging heat dissipation
