摘要
目前,芯片设计面临“面积墙”的挑战,这为芯片制造带来了高昂的流片成本。芯粒技术可以通过成熟的工艺制程制造较小面积的芯片,然后通过先进封装方式打破面积墙的限制,实现芯片的敏捷设计,降低设计成本。而设置多大的芯粒颗粒度可以满足芯片设计的灵活需求,是利用芯粒技术的一个核心问题。芯粒功能的划分也影响着芯粒间的互连结构,如何实现各功能芯粒间互连是最终实现芯片功能的关键。因此,本文综述国内外近年来对芯粒功能划分上的研究、在芯粒设计空间上的探索以及芯粒功能划分对芯粒间互连网络影响,并指出芯粒的设计方法学是未来芯粒技术发展的重要研究方向。
Facing the challenge of the"area wall"in chip design,there is a significant increase in chip manufacturing costs.The chiplet technology enables the production of small area chips using a mature process,and composing by advanced packaging techniques,which can overcome the limitations imposed by the area wall,facilitating agile chip design and reducing overall design costs.Determining an optimal chiplet particle size to meet flexible chip design requirements remains a crucial issue when utilizing chiplet technology.Furthermore,achieving interconnectivity between functional chiplets after dividing chip functions is pivotal for realizing the final functionality of the chip.Therefore,this paper provides a comprehensive review of recent research on chiplet function division,spatial exploration in chiplet design and the influence of chiplet function division on the inter-chip interconnect,while also pointing out that chipet design methodology is an important research direction for the development of chiplet technology in the future.
作者
陈龙
黄乐天
CHEN Long;HUANG Letian(School of Integrated Circuit Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China)
出处
《集成电路与嵌入式系统》
2024年第2期41-49,共9页
INTEGRATED CIRCUITS AND EMBEDDED SYSTEMS
基金
高可扩展多芯粒异构集成存内计算加速器架构研究(92373111)。
