摘要
采用甲基三甲氧基硅烷和二甲基二甲氧基硅烷对硅溶胶进行改性制得有机硅改性硅溶胶封孔剂,并通过浸渍和加热固化的方法对多孔Al_(2)O_(3)陶瓷片进行封孔处理。研究了固化温度和固化时间对封孔Al_(2)O_(3)陶瓷片绝缘性能的影响,并对多孔Al_(2)O_(3)陶瓷片封孔前后的微观结构进行了表征。结果表明,较佳封孔条件为固化温度120℃、固化时间60 min,此时封孔Al_(2)O_(3)陶瓷片的直流和交流击穿电压分别达到最大值10.76 kV和6.01 kV,1000 V绝缘电阻不低于9999 MΩ。封孔Al_(2)O_(3)陶瓷片表面为改性硅溶胶涂层,呈致密无孔隙状态且与基体结合紧密,涂层厚度约为25μm,表面水接触角提高到86.93°,封孔层深度约为10μm。
The organosilicon modified silica sol sealant was prepared by modifying silica sol with methyltrimethoxysilane and dimethyldimethoxysilane,and the porous Al_(2)O_(3) ceramic sheets were sealed by impregnation and heating curing.The effects of curing temperature and time on the insulation properties of porous Al_(2)O_(3) ceramics sheets were studied,and the microstructure of porous Al_(2)O_(3) ceramic sheets before and after sealing was characterized.The results show that the optimal conditions are that curing temperature of 120℃and curing time of 60 min,at which the DC and AC breakdown voltage of the Al_(2)O_(3) ceramic sheets reach the maximum values of 10.76 kV and 6.01 kV respectively,and the insulation resistance of 1,000 V reaches more than 9,999 MΩ.The surface of the Al_(2)O_(3) ceramic sheet is a modified silica sol coating,which is compact,non-porous and tightly bound to the matrix.The coating thickness is about 25 mm,the surface water contact angle is increased to 86.93°,and the depth of the layer is about 10μm.
作者
黎春阳
唐虎娇
郑文杰
张俊计
李国军
LI Chunyang;TANG Hujiao;ZHENG Wenjie;ZHANG Junji;LI Guojun(School of Environment and Chemical Engineering,Dalian Jiaotong University,Dalian 116028,China;National Bearing Engineering Technology Research Center Co.,Ltd.,Wafangdian Bearing Group,Dalian 116300,China;School of Material Science and Engineering,Dalian Jiaotong University,Dalian 116028,China)
出处
《有机硅材料》
CAS
2024年第1期1-6,共6页
Silicone Material
基金
国家重点研发计划(2020YFB2007803)
大连市揭榜挂帅科技公关项目(2021JB12GX014)。
