摘要
有机基板作为IC封装的重要载体,其制造材料的特性对封装工艺的稳定性及可靠性有重要影响。针对倒装芯片球栅阵列(FCBGA)有机基板在再流焊过程中的翘曲问题,使用热形变测试仪研究了不同尺寸和芯板厚度的有机基板在再流焊过程中的共面性及形变情况,研究FCBGA有机基板的翘曲行为。针对大尺寸FCBGA有机基板在再流焊过程中的翘曲问题,从脱湿、夹持载具以及再流焊曲线优化等方面提出改善措施,为FCBGA有机基板的封装应用提供参考。
Organic substrates are important carriers for IC packaging,the characteristics of their fabrication materials have an important impact on the stability and reliability of the packaging process.In response to the warpage problem of flip chip ball grid array(FCBGA)organic substrates during the reflow soldering process,a thermal deformation tester is used to study the coplanarity and deformation of organic substrates with different sizes and different core plate thicknesses during the reflow soldering process,and the warpage behavior of FCBGA organic substrates is studied.In response to the warpage problem of large-size FCBGA organic substrates during the reflow soldering process,improvement measures are proposed in terms of dehumidification,clamping carrier and optimization of reflow soldering curves,which provide a reference for the packaging application of FCBGA organic substrates.
作者
李欣欣
李守委
陈鹏
周才圣
LI Xinxin;LI Shouwei;CHEN Peng;ZHOU Caisheng(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)
出处
《电子与封装》
2024年第2期55-61,共7页
Electronics & Packaging
关键词
FCBGA有机基板
再流焊
翘曲
脱湿
FCBGA organic substrate
reflow soldering
warpage
dehumidification
