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Sn对Cu-Sn-Ti钎料显微组织与性能的影响

Effect of Sn on the microstructure and properties of Cu-Sn-Ti brazing filler metal
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摘要 为揭示Sn调控Cu-Sn-Ti钎料显微组织与力学性能的规律,采用真空非自耗熔炼法制备Cu-Sn-Ti钎料,利用扫描电镜、X射线衍射仪、能谱仪、万能材料试验机等,研究了Sn对Cu-Sn-Ti钎料的显微组织、显微硬度、剪切强度及断口形貌的影响.结果表明,钎料显微组织随Sn含量增加而演变的规律为:枝晶状初生α-Cu基体相+共晶组织+晶间组织→初生α-Cu基体相+共晶组织→共晶组织→初生CuSn_(3)Ti_(5)相+粗化共晶组织+α-Cu基体相(富Sn)+Cu_(41)Sn_(11)相+SnTi_(3)相,其中晶间组织为α-Cu相和CuSn_(3)Ti_(5)相的混合组织+少量的(SnTi_(3)+CuTi相+Cu_(3)Ti相).随着Sn含量的增加,钎料显微硬度呈先增大后减小的趋势,钎料剪切强度呈逐渐减小的趋势,断口形貌由准解理断裂向解理断裂+准解理断裂的混合形态转变.增加Sn含量促使钎料形成粗化的CuSn_(3)Ti_(5)相和共晶组织是导致钎料剪切强度下降的主要原因. In order to reveal the regulation of Sn on the microstructure and mechanical properties of Cu-Sn-Ti brazing filler metal,Cu-xSnxTi10 brazing filler metals were prepared by vacuum non-self-consumption melting method,and the effects of Sn on the microstructure,microhardness,shear strength and fracture morphology of Cu-Sn-Ti brazing filler metals were investigated by using scanning electron microscopy(SEM),Xray diffractometer(XRD),energy spectrometer(EDS),and universal material testing machine,etc.the results showed that:the microstructure evolution of the solder with the increase of Sn content was as follows:dendritic primary α-Cu matrix phase+eutectic tissue+intergranular tissue→primaryα-Cu matrix phase+eutectic tissue→eutectic tissue→primary CuSn_(3)Ti_(5) phase+coarsened eutectic tissue+α-Cu matrix phase(Snrich)+Cu_(41)Sn_(11) phase+SnTi_(3) phase,in which the intergranular tissue was a mixed structure of α-Cu phase and CuSn_(3)Ti_(5) phase+a small amount of SnTi_(3)+CuTi phase+Cu_(3)Ti phase.With the increase of Sn content,the microhardness of filler metal increases first and then decreased,the shear strength of filler metal decreasing gradually,and the fracture morphology changed from the quasi-cleavage fracture to the mixture of cleavage fracture and quasi-cleavage fracture.The increase of Sn content promoted the formation of coarsened CuSn_(3)Ti_(5) phase and eutectic tissue in the filler metal,which was the main reason for the decrease of shear strength of brazing metal.
作者 杜全斌 张黎燕 李昂 崔冰 黄俊兰 DU Quanbin;ZHANG Liyan;LI Ang;CUI Bing;HUANG Junlan(Henan Key Laboratory of Intelligent Manufacturing Equipment Integration for Superhard Materials,Henan Mechanical and Electrical Vocational College,Zhengzhou,451191,China;Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials,Ministry of Education,Anhui University of Technology,Ma'anshan,243002,China;State Key Laboratory of New Brazing Materials and Technology,Zhengzhou Reserch Institute of Mechanical Engineering Co.,Ltd.Zhengzhou,450001,China)
出处 《焊接学报》 EI CAS CSCD 北大核心 2024年第2期89-97,I0008,共10页 Transactions of The China Welding Institution
基金 河南省科技攻关计划项目(222102220114、232102220058) 河南省高等学校重点科研项目计划支持(24A460008).
关键词 Cu-Sn-Ti钎料 显微组织 剪切强度 显微硬度 Cu-Sn-Ti brazing filler metal microstructure shear strength microhardness
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