摘要
随着对先进封装需求的快速增加,作为封装载体的封装基板的需求也大幅度增加,而国际和国内的标准化组织暂时都还没有制订出刚性有机封装基板的产品标准,生产厂家、用户对产品的质量要求和检验方法等无法有效统一,容易造成重复认证和质量问题的经济索赔等。要解决这些矛盾,就需要研制用户和生产厂家都能接受的产品标准。本文就刚性有机封装基板标准的研制进行了探讨,并展示了最新的进展。
With the rapid increase in demand for advanced packaging,the demand for packaging substrates as packaging carriers has also significantly increased.However,international and domestic standardization organizations have not yet formulated product standards for rigid organic packaging substrates,and manufacturers and users cannot effectively unify their quality requirements and inspection methods,which can easily lead to repeated certification and economic claims for quality problems.To solve these contradictions,We need to develop product standards that are acceptable to both users and manufacturers.This article explores the development of standards for rigid organic packaging substrates and presents the latest developments.
出处
《印制电路资讯》
2024年第1期18-24,共7页
Printed Circuit Board Information
关键词
刚性有机封装基板
封装
金属丝键合
倒装封装
rigid organic packaging substrate
packaging
metal wire bonding
flip chip packaging
