摘要
Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.
基金
This work is financially supported by the National Natural Science Foundation of China(52303036)
the Natural Science Foundation of Guangxi Province(2020GXNSFAA297028)
the Guangxi Science and Technology Base and Talent Special Project(GUIKE AD23026179)
the International Science&Technology Cooperation Project of Chengdu(2021-GH03-00009-HZ)
the Program of Innovative Research Team for Young Scientists of Sichuan Province(22CXTD0019)
the Natural Science Foundation of Sichuan Province(2023NSFSC0986)
the Opening Project of State Key Laboratory of Polymer Materials Engineering(Sichuan University)(Sklpme2023-3-18).
