摘要
面对金属封装高压隔离微系统内部潜在的击穿和爬电风险,结合高精度建模和图论思想建立一种新的可靠性分析方法,为产品的设计和测试提供有力保障。首先,将微系统三维模型转化为点云模型,经滤波和曲面重构形成可计算的数值模型;之后,根据几何特征和物理关系,将表面爬电问题和击穿问题分别等效为测地路径和欧氏路径的计算;并根据微系统布局方式优化Dijkstra算法,计算封装后的击穿和爬电路径;最终,参考实验标准判断产品风险等级。对照实验结果与计算匹配,精度理想,表明该方法对微系统相关问题的有效性。
This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method,which provides a strong guarantee for product design and testing,for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package products.Firstly,the 3D model of the product is converted into a point cloud model,and a computable numerical model is formed through filtering and surface reconstruction.Then,according to the geometric characteristics and physical relations,the surface creepage problem and breakdown problem are equivalent to the calculation of geodesic path and Euclidean path,respectively.According to the layout,the Dijkstra algorithm is optimized to calculate the breakdown and creepage paths after packaging.Finally,the product risk level is judged by reference to the experimental standards.The results of the control experiment match the calculation with ideal accuracy,indicating the effectiveness of the method for microsystem-related problems.
作者
王辂
柏晗
曾燕萍
丁涛杰
Wang Lu;Bai Han;Zeng Yanping;Ding Taojie(The 58th Research Institute of China Electronics Technology Group Corporation,Wuxi 214000,China)
出处
《电子技术应用》
2024年第2期38-42,共5页
Application of Electronic Technique
基金
中国博士后科学基金面上项目(2022M722962)。
关键词
微系统
点云分析
DIJKSTRA算法
击穿现象
爬电现象
system-in-package
point cloud analysis
Dijkstra algorithm
high-voltage breakdown
high-voltage creepage
