摘要
邻苯二甲腈封端的聚芳醚腈(PEN-Ph)具有高耐热及高化学稳定性等特点,在航空航天和电子领域有广泛应用.通过后固相化学反应,PEN-Ph端基上的邻苯二甲腈及分子链的侧氰基可相互反应生成稳定的结构,使材料从线性结构转化为体型结构,提升耐温等级与机械性能.影响PEN-Ph交联反应的因素有内外2种,内因主要包括聚芳醚腈分子主链化学结构、分子量与分子量分布,以及邻苯二甲腈封端量等;外因主要包括热处理工艺、交联剂和催化剂等.基于此,重点阐述了外因如何影响PEN-Ph的交联行为及性能.此外,还成功制备了耐高温、高强度和高模量PEN-Ph单组分自增强复合材料,以期用于电容器薄膜及挠性覆铜板等领域.
Phthalonitrile terminated with polyarylene ether nitrile(PEN-Ph)is widely used in the aerospace and electronics fields due to its high temperature resistance and high chemical stability,etc.After applying post-solid phase chemical reaction technology,Phthalonitrice on the end group of PEN-Ph and the side cyanide group of the molecular chain can interact with each other to from a stable structure,which is transformed from linear to three-dimension network.Thus,the temperature-resistant level and mechanical performance are greatly enhanced.Specifically,there are two factors affecting PEN-Ph cross-linking reaction:internal factors mainly include main chain chemical structure,molecular weight and molecular weight distribution,the end-capping groups content;external factors mainly include the heat treatment process,cross-linking agent,and catalyst.Based on this,focusing on how external factors affect the cross-linking behavior and properties of PEN-Ph.In addition,PEN-Ph single-component composites with high temperature resistance,high strength and high modulus have been successfully prepared,which is expected to be used in the fields of capacitor films and flexible copper clad laminates.
作者
何亮
童利芬
刘孝波
HE Liang;TONG Lifen;LIU Xiaobo(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处
《成都大学学报（自然科学版）》
2024年第1期53-60,共8页
Journal of Chengdu University（Natural Science Edition）
基金
国家自然科学基金(51903029)
四川省科技厅科技计划项目重大专项(2019ZDZX0016)。
关键词
邻苯二甲腈
封端
聚芳醚腈
交联反应
耐高温
phthalonitrile
terminal
polyarylene ether nitrile
cross-linking reaction
high-temperature-resistance
