摘要
在硅片磨削时,硅片加工质量与硅片磨床的进给系统性能密切相关。为了提升硅片磨床进给系统的精度和稳定性,提出了采用上位机、运动控制卡、伺服驱动器、位置传感器进行闭环控制进给的技术方案。研究了伺服系统和机械系统两者之间的相互耦合关系,建立了动力学模型,搭建了基于PID控制的三闭环控制系统,采用MATLAB中Simulink模块对进给系统进行仿真分析。仿真结果表明,磨床进给系统速度波动量在1%以下满足硅片磨削对进给精度的要求。
The quality of silicon grinding is closely related to the performance of the feed system of silicon grinding machine.In order to improve the accuracy and stability of the feed system of silicon chip grinding machine,a technical scheme of closed-loop control feed is put forward,which uses host computer,motion control card,servo driver and position sensor.The coupling relationship between the servo system and the mechanical system is studied,the dynamics model is established,and the three closed-loop control system based on PID control is built.Simulink module in MATLAB is used to simulate and analyze the feed sys-tem.The simulation results show that,The speed fluctuation of the grinding machine feed system is less than 1%to meet the requirements of silicon chip grinding for feed accuracy.
作者
张逸民
朱祥龙
董志刚
康仁科
徐嘉慧
张津豪
ZHANG Yimin;ZHU Xianglong;DONG Zhigang;KANG Renke;XU Jiahui;ZHANG Jinhao(State Key Laboratory of High-Performance Precision Manufacturing,Dalian University of Technology,Dalian 116024,China)
出处
《组合机床与自动化加工技术》
北大核心
2024年第4期102-104,109,共4页
Modular Machine Tool & Automatic Manufacturing Technique
基金
国家重点研发计划项目(2020YFB2007600)
国家自然科学基金面上项目(51991372)
辽宁省“兴辽英才计划”项目(XLYC2007049)。
关键词
硅片磨床
伺服进给系统
三闭环控制
动力学模型
silicon wafer grinder
servo feed system
three-loop control
dynamical model
