摘要
晶圆金金键合技术在集成电路封装、微机电系统(MEMS)器件制造、CMOS图像传感器制作及LED制造等行业中被广泛应用。在MEMS环形器的制造过程中,由于金金键合的压力分布不均匀,导致其键合有效区域仅限于键合区域的边缘位置,即存在键合局域化问题,因此器件的整体可靠性较差。结合有限元力学仿真和金金键合实验,优化了键合点的分布,确保键合压力分布更加均匀。将有效键合面积从20%提升到77%,单颗芯片的平均剪切力从41.5 N增大到80.3 N,有效提升了MEMS环形器的可靠性。
Wafer level Au-Au bonding technology is widely used in industries such as integrated circuit packaging,micro-electro-mechanical system(MEMS)device fabrication,CMOS image sensor fabrication and LED manufacturing.In the manufacturing process of MEMS circulator,due to the uneven pressure distribution of Au-Au bonding,the effective bonding area is limited to the edge position of the bonding area,which leads to the problem of bonding localization.Therefore,the overall reliability of the device is poor.Combining finite element simulation and Au-Au bonding tests,the distribution of bonding points is optimized to ensure a more uniform bonding pressure distribution.The effective bonding area is increased from 20%to 77%,and the average shear force of a single chip is increased from 41.5 N to 80.3 N,which effectively improves the reliability of the MEMS circulator.
作者
张丹青
韩易
商庆杰
宋洁晶
杨志
ZHANG Danqing;HAN Yi;SHANG Qingjie;SONG Jiejing;YANG Zhi(China Electronics Technology Group Corporation No.13 Research Institute,Shijiazhuang 050051,China)
出处
《电子与封装》
2024年第4期8-13,共6页
Electronics & Packaging
关键词
封装技术
金金键合
MEMS环形器
有限元仿真
packaging technology
Au-Au bonding
MEMS circulator
finite element simulation
