摘要
采用有限元模拟研究了堆叠封装(Package on package, PoP)在温度循环和随机振动载荷下的焊点可靠性,包括封装内部的基板堆叠焊点和封装外部的板级互连焊点。通过应力分析定位危险焊点并计算焊点在温度循环下的疲劳寿命。模拟结果表明:在温度循环载荷下,应力主要集中于基板边角处焊点,基板堆叠焊点的疲劳寿命为3 002周次,板级互连焊点的疲劳寿命为1 552周次;在随机振动载荷下,两层焊点的应力值均较低,在50~2 000 Hz的随机振动频率范围内具有较高的可靠性。
In this paper,the reliability of solder joints in package on package(PoP)subjected to temperature cycling and random vibration load was studied by finite element simulation,including the solder joints inside the package for substrate stacking and the solder joints outside the package for board-level interconnection.The dangerous solder joints were located through stress analysis,and the fatigue life of solder joints subjected to temperature cycling was calculated.The simulation results show that the stress is mainly concentrate on the solder joints at the corner of the substrate subjected to thermal cycling.The fatigue life of solder joints for substrate stacking is 3002 cycles,and the fatigue life of solder joints for board-level interconnection is 1552 cycles.The stress value of solder joints in both two layers is relatively small subjected to random vibration load,with relatively high reliability in the random vibration frequency range of 50-2000 Hz.
作者
潘碑
王宏光
李宇轩
葛振霆
陈鹏鹏
PAN Bei;WANG Hongguang;LI Yuxuan;GE Zhenting;CHEN Pengpeng(Nanjing Electronic Devices Institute,Nanjing,210016,CHN)
出处
《固体电子学研究与进展》
CAS
2024年第2期161-166,共6页
Research & Progress of SSE
关键词
焊点可靠性
温度循环
随机振动
疲劳寿命预测
有限元模拟
reliability of solder joint
temperature cycling
random vibration
fatigue life prediction
finite element simulation
