摘要
针对微电子机械系统(MEMS)圆片级封装腔体体积小、传统的真空封装测试方法适用性差的情况,研制了一种用于表征圆片级真空封装真空度的器件——MEMS微谐振器。利用此谐振器不仅可以表征圆片级真空封装真空度,也可用于圆片级真空封装漏率的测试。采用MEMS体硅工艺和共晶圆片键合技术实现了微谐振器的圆片级真空封装,利用微谐振器阻尼特性建立了谐振器品质因数与真空度的对应关系,通过设计的激励电路实现了微谐振器品质因数的在片测试,对不同键合腔体真空度下封装的MEMS微谐振器进行测试,测试结果显示该微谐振器在高真空度0.1~8 Pa范围内品质因数与真空度有很好的对应关系。
In view of the small volume of micro-electromechanical system(MEMS)wafer level package and the poor applicability of the traditional vacuum packaging test method,a device named MEMS micro-resonator was developed to characterize the vacuum degree of wafer level vacuum package.The resonator can not only characterize the vacuum degree of wafer level vacuum package,but also test the leakage rate of wafer level vacuum package.The wafer level vacuum package of the micro-resonator was realized by MEMS bulk silicon technology and eutectic wafer bonding technology.The corresponding relationship between the quality factor of the resonator and the vacuum degree was established by using the damping characteristics of the micro-resonator.The quality factor of micro-resonator was tested on chip through the designed excitation circuit.The MEMS micro-resonators packaged under different bonding cavity vacuum degrees were tested.The test results show that the quality factor of the micro-resonator has a good correspondence with the vacuum degree in the high vacuum degree range of 0.1-8 Pa.
作者
胥超
王敏
杨志
Xu Chao;Wang Min;Yang Zhi(The 13th Research Institude,China Electronics Technology Group Corporation,Shijiazhuang 050051,China)
出处
《微纳电子技术》
CAS
2024年第5期162-167,共6页
Micronanoelectronic Technology
