摘要
晶圆是一种制作硅半导体积体电路所用的硅晶片,是制作半导体芯片的基本材料,在半导体集成电路等芯片(Integrated Circuit Chip,IC)产业具有重要地位,因此对晶圆制作工艺要求极高。以晶圆冷却工艺为出发点,设计并制备一种冷却盘体。首先,通过分析选择不锈钢+表面镀镍层铜作为冷却盘体的制作材料。其次,设计分析冷却盘体的结构、厚度及制作工艺,并得出设计创新点。最后,实际使用效果显示,该冷却盘体的散热速率可达2.68℃·s^(-1),且在实施冷却降温过程中没有发生变形及铜离子泄漏问题,也未出现漏水、漏气问题。
Wafer is a kind of silicon wafer used in the production of silicon semiconductor Integrated Circuit,is the basic material for the production of semiconductor chips,in the semiconductor Integrated Circuit Chip(IC)industry has an important position,so the wafer production process requirements are extremely high.Based on the cooling process of wafer,a cooling disc is designed and prepared.Firstly,through analysis,stainless steel+nickel plated copper is selected as the production material of the cooling disc body.Secondly,the structure,thickness and manufacturing process of the cooling disc are analyzed,and the design innovation points are obtained.Finally,the actual application results show that the cooling rate of the cooling disc can reach 2.68℃·s^(-1),and there is no deformation and copper ion leakage during the cooling process,and there is no water leakage and gas leakage.
作者
鲍伟江
BAO Weijiang(Shanghai Ruisheng Semiconductor Technology Co.,Ltd.,Shanghai 200000)
出处
《现代制造技术与装备》
2024年第4期48-50,共3页
Modern Manufacturing Technology and Equipment
关键词
半导体
晶圆
冷却盘体
散热速率
semiconductor
wafer
cooling disc body
heat dissipation rate
