摘要
MLCC电容的全称为多层片式陶瓷电容器(Multi-layer Ceramic Capacitor,英文缩写MLCC),是由陶瓷介质薄膜与内电极以层层错位的方法交替叠合,经过高温一次性烧结制成陶瓷芯片,最后在陶瓷芯片的两端涂覆外电极浆料而制成的电容器。因此,MLCC的内应力复杂,耐环境应力的能力有限。在实际的复杂使用环境中,MLCC往往会由于经受机械应力、电应力以及温度应力的综合作用导致MLCC出现裂纹或金属电极错位而失效。本文通过对MLCC电容典型失效案例的解析,总结了常见MLCC的失效原因,对复杂工况下PCBA的可靠性设计有一定参考意义。
The full name of MLCC capacitor is Multi-layer Chip Ceramic Capacitor(Multi-layer Ceramic Capacitor,abbreviated as MLCC),which is made of ceramic dielectric film and inner electrode alternately stacked by layer by layer mismatch method,and then made into ceramic chip by one-time sintering at high temperature,and then finally made into capacitor by coating outer electrode slurry at the two ends of the ceramic chip.As a result,MLCCs have complex internal stresses and limited ability to withstand environmental stresses.In the actual complex use of the environment,MLCC will often be subjected to mechanical stress,electrical stress and temperature stress of the combined effect of the MLCC cracks or metal electrode misalignment and failure.In this paper,through the analysis of the typical failure cases of MLCC capacitors,we summarize the common reasons for the failure of MLCC,which is of some reference significance for the reliability design of PCBA under complex working conditions.
出处
《日用电器》
2024年第4期108-112,共5页
ELECTRICAL APPLIANCES
