摘要
倒装芯片是先进封装中的主流技术之一,而凸块制备工艺又是倒装芯片关键技术之一,随着消费类电子产品朝着轻薄短小的趋势发展、芯片集成度越来越高、引脚数越来越密集,凸块制备工艺也在随之发展。凸块制备工艺包括UBM、蒸发、C4NP、模板印刷和电镀工艺。随着芯片尺寸的减小,焊球凸块逐步向铜柱凸块发展。同时还要应对细间距铜柱带来的共面性问题、应力问题和金属间化合物生长等可靠性问题。
Flip chip is one of the major technologies in advanced packaging,and the bump preparation process is one of the key technologies forflip chip.With the trend of consumer electronics products toward lighter,thinner,shorter,and smaller,chips are becoming more and more integrated,with denser pin counts,and the bump preparation process is evolving along with it.Bump preparation processes include under bump metallization,evaporation,C4NP,stencil printing and electroplating technology.As the chip size decreases,solder bumps are gradually evolving into copper pillar bumps.At the same time,the reliability issues of coplanarity,stress,and intermetallic compound growth associated withfine-pitch copper pillar bump have to be met.
作者
丁增千
李圣贤
DING Zengqian;LI Shengxian(Gusu Laboratory of Materials,Suzhou 215000,China)
出处
《电子工艺技术》
2024年第3期1-5,共5页
Electronics Process Technology
关键词
倒装芯片
焊球凸块
综述
铜柱凸块
制备工艺
flip chip
solder bump
review
Cu pillar bump
preparation technology
