摘要
碳化硅是空间光学元件理想材料之一,但其磨削亚表面会产生较严重的面损伤,影响光学元件生产效率、性能发挥及使用寿命。为了更好地控制碳化硅超声磨削亚表面损伤,开展了超声辅助磨削数值仿真和试验研究,建立磨粒的运动轨迹方程,研究加工参数对运动学特性的影响规律,分析超声振动辅助对磨削过程材料去除的影响机理,讨论加工参数影响下的碳化硅超声磨削去除机理和亚表面损伤特征,建立亚表面损伤深度预测模型。结果表明,施加超声振动辅助后磨粒的运动学特性发生周期性变化,磨粒周期性地冲击工件;碳化硅在超声磨削过程中主要有三种去除方式:穿晶裂纹撕裂晶粒发生脆性断裂去除、晶界裂纹扩展至碳化硅表面导致单颗晶粒脱落以及晶界裂纹沿多颗晶粒的晶界扩展至碳化硅表面导致块状脱落;经验证,亚表面损伤深度模型预测精度较好,预测值与检测值的方差为0.219。
Silicon carbide is one of the ideal materials for space optical components,but its grinding subsurface will cause serious surface damage,which will affect the production efficiency,performance and service life of optical components.In order to better control the sub-surface damage of ultrasonic grinding of silicon carbide,numerical simulation and experimental research of ultrasonic assistance grinding are carried out,the motion trajectory equation of abrasive particles is established,the influence law of machining parameters on kinematic characteristics is studied,and the influence mechanism of ultrasonic vibration assisted on material removal in grinding process is analyzed.The removal mechanism and subsurface damage characteristics of sic in ultrasonic grinding under the influence of machining parameters are discussed,and the prediction model of subsurface damage depth is established.The results show that the kinematic characteristics of the abrasive particles change periodically and the abrasive particles impact the workpiece periodically.There are three main removal methods in the process of ultrasonic grinding of silicon carbide:transgranular crack tearing the grain and brittle fracture removal,grain boundary crack extending to the surface of silicon carbide leading to single grain shedding,and grain boundary crack extending to the surface of silicon carbide along the grain boundary leading to massive shedding.It has been proved that the prediction accuracy of subsurface damage depth model is better,and the variance between predicted value and detected value is 0.219.
作者
梁奉爽
吴明阳
刘立飞
LIANG Fengshuang;WU Mingyang;LIU Lifei(School of Mechanical and Power Engineering,Harbin University of Science and Technology,Harbin 150080;College of Mechanical Engineering,Chongqing University of Technology,Chongqing 400054)
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2024年第9期75-85,共11页
Journal of Mechanical Engineering
基金
国家自然科学基金(51705111)
黑龙江省普通本科高等学校青年创新人才培养计划(UNPYSCT-2020192)
重庆理工大学科研启动基金资助项目。
关键词
碳化硅
超声振动辅助
磨削
亚表面损伤
silicon carbide ceramics
ultrasonic vibration assistance
grinding
subsurface damage
