摘要
随着数据传输速率的不断增加,对高速互连的信号完整性设计和优化变得至关重要。在高速通道设计的各个方面中,我们通过对现有的方法进行综述来着重介绍准确的PCB材料电磁表征这一关键问题,并对于提取PCB材料特性,如介电常数、损耗正切以及铜表面粗糙度的各种方法进行分类。首先,这些方法分为两大类:①对原始介质材料进行表征的技术;②适用于一般由玻璃纤维和树脂材料混合而成的PCB材料的表征方法。在每个类别中,简要描述了几种常用技术,并进行了优缺点的比较和讨论。基于传输线的方法的挑战和局限性在这里尤为重要,因为相关的材料特性提取程序在工业中已经是常规操作。此外,特别是在数十吉赫兹的频率范围内,典型铜箔表面粗糙度对准确材料表征的影响也被考虑。本文旨在通过总结和比较提供PCB材料表征方法的全面概述和分析。
With the ever-increasing data rate,signal integrity design and optimization for highspeed interconnects has become crucial.Among all the aspects of successful high-speed channel design,we address a critical problem of accurate PCB material characterization through an overview of the proposed Electromagnetic methodologies.Various approaches for the extraction of PCB material properties,namely,dielectric constant,loss tangent,and copper surface roughness,are first classified into two main categories:①characterization techniques for raw dielectric materials;②methodologies feasible for PCB materials which are generally regarded as composites of glass fiber and resin.In each category,several popular techniques are briefly described,and the pros and cons are compared and discussed.The challenges and limitations of transmission-line based methods are of special interest herein,given that the associated material property extraction procedures have been common practice in industries.In addition,the impact of surface roughness of typical copper foils on accurate material characterization,especially in the frequency range of tens of giga hertz,is also examined.This paper is aiming to provide a comprehensive overview and insights of the material characterization methodologies through the summaries and comparisons.
作者
陈辉
CHEN Hui(CEPREI,Guangzhou 511370)
出处
《环境技术》
2024年第6期120-124,共5页
Environmental Technology
基金
工信部项目,项目编号:TC210804R-1
工信部电子五所所发展基金,项目编号:22Z18。
关键词
因果关系
介电常数
损耗正切
材料表征
铜表面粗糙度
S参数
分立式介质谐振器
传输线
causality
dielectric constant
loss tangent
material characterization
surface roughness
S-parameter
split-post dielectric resonator
transmission line
