摘要
在曝光设备中,预对准先将晶圆进行中心定位和角度找正,经过预对准的晶圆传送到工作台中方向及位置一致,保证设备稳定运行。为能满足键合晶圆的预对准要求,采用视觉与机械夹持的方式,设计预对准结构,获得键合晶圆的兼容性,保证设备对键合晶圆的稳定运行。
In the exposure equipment,the pre-alignment first centers the wafer and aligns the angle,and the pre-aligned wafer is transmitted to the workbench in the same direction and position to ensure the stable operation of the equipment.In order to meet the pre-alignment requirements of bonding wafers,the pre-alignment structure is designed by means of visual and mechanical clamping,so as to obtain the compatibility of bonding wafers and ensure the stable operation of the equipment on bonding wafers.
作者
李康平
刘冰鑫
周占福
LI Kangping;LIU Bingxin;ZHOU Zhanfu(The 45^(th) Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2024年第4期71-73,共3页
Equipment for Electronic Products Manufacturing
关键词
晶圆寻边
视觉寻边
图像处理技术
Wafer edge finding
Visual edge finding
Image processing technology
