摘要
当前,丝网印刷厚膜工艺已成为高温共烧陶瓷(HTCC)生瓷生产中的关键工艺,高密度陶瓷封装外壳的典型埋层布线线宽/线间距要求已达到45μm/45μm,为满足精细线条批量印刷要求,主要从原材料、网版和印刷工艺参数等方面分析了影响精细丝网印刷质量的因素。通过选用窄线径丝网规范(<15μm)的精密印刷网版,并调节浆料黏度至合适范围,同时优化印刷工艺参数,将印刷速度调整到250~300mm/s,减少了孔隙、断路、扩散等线条缺陷,印刷出状态优异的45μm线宽精细线条,从而实现45μm/45μm线宽/线间距的批量印刷,满足了高密度陶瓷封装外壳工艺要求。
At present,the thick film process of screen printing has become a crucial process in the production of green tapes of high temperature co-fired ceramics(HTCCs).The typical wiring line width/line spacing requirement of buried layer for high density ceramic packaging shell has reached 45μm/45μm.In order to meet the requirements of fine line batch printing,the factors affecting the quality of fine line screen printing were mainly analyzed from the aspects of raw materials,screen plate and printing process parameters.Through selecting a precise printing screen plate with mesh specification of the narrow wire diameters(<15μm),adjusting the slurry viscosity to the appropriate range,optimizing the printing process parameters and adjusting the printing speed to 250~300 mm/s,the line defects,such as pore,line break,diffusion and so on,are reduced.The fine line with line width of 45μm is printed in excellent condition,realizing the batch printing of 45μm/45μm line width/line spacing and meeting the technology requirements of the high density ceramic packaging shell.
作者
王杰
淦作腾
马栋栋
刘洋
程换丽
刘曼曼
闫昭朴
段强
Wang Jie;Gan Zuoteng;Ma Dongdong;Liu Yang;Cheng Huanli;Liu Manman;Yan Zhaopu;Duan Qiang(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China)
出处
《微纳电子技术》
CAS
2024年第8期67-72,共6页
Micronanoelectronic Technology
关键词
厚膜
丝网印刷
精细印刷
高密度陶瓷封装外壳
高温共烧陶瓷(HTCC)
网版
thick film
screen printing
fine printing
high density ceramic packaging shell
high temperature co-fired ceramic(HTCC)
screen plate
