摘要
通过Surface Evolver软件预测了塑料球栅阵列(PBGA)焊点形态,将焊点形态结果导入Ansys软件中进行-55~125℃热循环仿真实验,通过Coffin-Masson模型预测焊点寿命。选取焊点钎料量、焊点高度、下焊盘直径作为影响焊点寿命的主要因素进行了3因素3水平正交实验,通过均值响应分析得到了影响凸点寿命的最敏感因素及最优形态尺寸组合。结果表明对焊点寿命影响最大的因素为下焊盘半径,其次是钎料量,最后是焊点高度,且上下等大的焊盘具有较好的可靠性。
The solder joint morphology of plastic ball grid array(PBGA)is predicted by Surface Evolver software,the results of the solder joint morphology are imported into Ansys software to conduct thermal cycling simulation experiments from-55℃to 125℃,and the solder joint life is predicted by Coffin-Masson model.The three factors and three levels of orthogonal experiments are carried out by selecting the amount of brazing material in the solder joint,the height of the solder joint,and the diameter of the lower pad as the main factors affecting the life of the solder joint,and the most sensitive factor affecting the life of the bump and the optimal combination of morphology and size are obtained through the mean-response analysis.The results show that the most influential factor on the life of the solder joint is the lower pad radius,followed by the amount of solder,and finally the height of the solder joint.Additionally,the upper and lower pads of equal size have better reliability.
作者
张威
刘坤鹏
张沄渲
于沐瀛
王尚
田艳红
ZHANG Wei;LIU Kunpeng;ZHANG Yunxuan;YU Muying;WANG Shang;TIAN Yanhong(State Key Laboratory of Precision Welding&Joining of Materials and Structures,Harbin Institute of Technology,Harbin 150001,China)
出处
《电子与封装》
2024年第8期40-46,共7页
Electronics & Packaging
基金
国家自然科学基金叶企孙联合基金(U2241223)。
