摘要
引脚金属镀层化学腐蚀是一种典型的封装缺陷,通常在高温、高压、高湿条件下容易出现,并对产品的可靠性和使用寿命造成严重影响。为研究镀锡引脚在高压蒸煮试验下的腐蚀情况,通过金相分析、扫描电镜分析、X射线光电子能谱等分析手段,对高压蒸煮条件下的镀锡引脚化学腐蚀情况进行了研究。结果表明,引脚上化学腐蚀主要是由于锡层-铜层-薄液膜之间的电化学反应造成的,镀锡层表面形貌粗糙会加剧腐蚀的形成。对此,提出了相应的改善措施,对于提高镀层的耐腐蚀性能具有重要的参考意义。
Chemical corrosion of pin metal coating is a typical packaging defect,which usually occurs under high temperature,high pressure and high humidity conditions,and has a serious impact on the reliability and service life of poduct.In order to study the corrosion of tin plated pins under pressure cooker test,the chemical migration of tin plated pins under pressure cooker test is studied by metallographic analysis,scanning electron microscopy analysis,X-ray photoelectron spectroscopy and other analysis methods.The results show that the main reason of chemical migration is the electrochemical reaction of tin-copper-thin liquid film formation,and the surface roughness of tin coating will aggravate the formation of corrosion.The corrosponding improvement measures are put forward,which has important reference significance for improving the corrosion resistance of the coating.
作者
张浩
李阳
王涛
肖汉武
ZHANG Hao;LI Yang;WANG Tao;Xiao Hanwu(Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214035,China)
出处
《电子产品可靠性与环境试验》
2024年第4期1-6,共6页
Electronic Product Reliability and Environmental Testing
基金
国家重点研发项目(2018YFB2202900)资助。
关键词
电化学迁移
镀锡引脚
腐蚀
高压蒸煮试验
electrochemical migration
tinning plated pin
corrosion
pressure cooker test
