摘要
芯粒集成技术作为一种可以延续摩尔定律的解决方案受到了学术界和产业界的高度关注,但其广泛应用还存在诸多问题。详细地总结了近十年来芯粒集成技术的研究进展和其独特优势,阐述了应用于芯粒集成技术的接口、标准和先进封装类型,研究了与芯粒集成相关的机遇和挑战,并对未来芯粒集成技术的发展进行了预测。
As a solution that can continue Moore's Law,core-particle integration technology has been highly concerned by academia and industry,but there still exist many problems in its wide application.In this paper,the research progress and unique advantages of core-particle integration technology in recent ten years are summarized in detail,the interface,standard and advanced package types applied to core-particle integration technology are described,the opportunities and challenges related to core-particle integration technology are studied,and the future development of core-particle integration technology is predicted.
出处
《焦作大学学报》
2024年第3期62-67,共6页
Journal of Jiaozuo University
关键词
芯粒
异构集成
芯片封装
芯片集成
core-particle
heterogeneous integration
chip packaging
chip integration
