摘要
现有CO_(2)激光无法满足印制电路板精细化布线对应的微小孔径加工要求,应开发其他类型激光钻孔。基于ABF、BT、PI这3种材料,探究355 nm纳秒紫外(Nano UV)、515 nm皮秒绿光(Pico Green)激光和248 nm ArF准分子激光3种激光加工微盲孔的能力。综合分析激光加工后孔径、锥度、悬铜、玻纤突出等关键指标表现,结果显示:Nano UV和准分子激光基于ABF、BT 2种材料可加工最小孔径为10μm,基于PI材料可加工最小孔径为15μm;Pico Green基于3种材料可加工最小孔径均为15μm。但Nano UV属于紫外波段纳秒激光器,加工带玻纤材料不具备优势。Pico Green更适用于加工带玻纤和带铜箔材料且加工后表观良好无溅铜。同时,3种激光对板材热效应影响均小于CO_(2)激光,材料形变差异在0.01%左右,对于密集区微盲孔加工友好。
The CO_(2) laser cannot meet the micro via requirements for fine wiring of PCB,and other types of lasers should be developed for drilling processing.This article explores the ability of 355 nm nansecond ultraviolet(Nano UV),515 nm picosecond green(Pico Green),and 248 nm ArF excimer lasers to process micro blind holes based on ABF,BT,and PI materials.After comprehensive analysis of key indicators such as diameter,taper,overhang,and glass fiber protrusion after laser processing,the results show that Nano UV and excimer lasers are able to process a 10μm via on AB and BT materials and a 15μm via on PI.Pico Green laser can process a 15μm via on all three materials.But Nano UV ia an ultraviolet band nanosecond laser and does not have advantages in processing fiberglass materials.Pico Green is more suitable for processing fiberglass and copper materials with good appearance and without splash.At the same time,the thermal effect of the three types of lasers on the sheet is slighter than that of CO_(2) laser,with the material deformation difference of about 0.01%,so these lasers are friendly for processing micro blind holes in dense areas.
作者
罗炜艳
曹子鲲
上官昌平
LUO Weiyan;CAO Zikun;SHANGGUAN Changping(AKM Meadville Electronics(Xiamen)Co.,Ltd.Ximen 361026,Fujian,China)
出处
《印制电路信息》
2024年第10期1-10,共10页
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