摘要
光敏聚酰亚胺(PSPI)是一类具有特殊结构的高性能聚酰亚胺材料,以其优异的耐热、力学、绝缘及光刻加工性等特点,广泛应用于半导体封装、集成电路、光学显示等领域。本文以在中国申请的PSPI专利为研究对象,分析了相关专利的整体情况,包括专利的申请数量变化、申请人与来源国等;重点梳理了自2011年以来的国内外专利申请人及专利主题分布,详细对比了国内外主要企业申请人的专利技术构成与保护重点,探讨了PSPI材料领域的专利技术特点与发展趋势。
Photosensitive polyimide(PSPI)is a kind of high-performance polyimide with special structures,which is widely used in semiconductor packaging,integrated circuits,optical display,and other fields due to its excellent heat resistance,mechanical properties,insulating properties,and lithographic processability.In this paper,the PSPI patents applied in China were taken as object,the overall situation of these patents,including changes in the number of patent applications,applicants,and their source countries was analyzed systematically.Especially,the patent applicants inside and outside China and the patent subject distribution since 2011 were discussed.The difference of patent technology and protection priorities of enterprise applicants inside and outside China was compared in detail.The patent technology characteristics and development trends of PSPI were explored.
作者
杨斐
郭彦
苑伟康
徐建锋
黄颖
赵锴
翟磊
范琳
YANG Fei;GUO Yan;YUAN Weikang;XU Jianfeng;HUANG Ying;ZHAO Kai;ZHAI Lei;FAN Lin(China National Intellectual Property Administration,Beijing 100081,China;Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190,China)
出处
《绝缘材料》
CAS
北大核心
2024年第10期98-105,共8页
Insulating Materials
基金
国家重点研发计划项目资助(2022YFB3603105)。
关键词
光敏聚酰亚胺
专利
国外申请人
技术主题
发展趋势
photosensitive polyimide
patent
foreign applicant
technical topics
development trend
