摘要
用羟基磷酸铜[Cu_(2)(OH)PO_(4)]作为激光敏化剂,然后用波长为1064 nm近红外(NIR)光谱激光选择性地活化聚酰亚胺(PI)薄膜预设区域,并采用化学镀铜(ECP)工艺进行金属化处理,成功地在PI薄膜表面制备了兼具高黏附性和高导电性的铜金属电路和图案。采用扫描电子显微镜(SEM)、能量色散谱仪(EDS)、X线光电子能谱仪(XPS)、光学显微镜(OM)和四探针电导率仪对聚酰亚胺复合薄膜表面的成分、形貌、结构以及铜金属线路的性能进行表征和测试,并探究了激光功率以及激光频率对铜线路质量的影响。结果表明,PI薄膜在近红外激光的作用下,激光活化的区域形成了粗糙形貌,XPS表明激光敏化剂被还原成Cu单质,作为活性种引发化学镀铜反应的发生。SEM以及OM结果表明,化学镀只在激光扫描过的区域发生,铜层厚度约为20μm,其电导率为2.78×10^(7)S/m。基于激光诱导选择性金属化(LISM)技术,制造了柔性电极、可拉伸电路以及地图图案,成形的电路与图案表现出良好的连续性以及较高的精细度,这为在透明聚合物基材上成形高性能、高精细度金属线路提供了新思路。
Metal circuits and patterns with both high adhesion and conductivity were successfully fabricated on the surface of polyimide(PI)films.To achieve that,the study used copper hydroxyl phosphate[Cu_(2)(OH)PO_(4)]as a laser sensitizer,and a near-infrared(NIR)laser with a wavelength of 1064 nm was employed to selectively activate the preset regions on PI films.Subsequently,metallization was performed using electroless copper plating(ECP)techniques.Scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS),X-ray photoelectron spectroscopy(XPS),optical microscopy(OM),and four-point probe conductivity measurements were used to characterize and test the composition,morphology,and structure of the PI composite film surface,as well as the performance of the metal circuits.The effects of the laser power and laser frequency on the quality of the copper circuits were also explored.The results showed that PI films exhibited a rough morphology in the laser-activated regions under the action of NIR laser.XPS results indicated the laser sensitizer was reduced to elemental copper,which acted as an active medium to initiate the electroless copper plating.SEM and OM analyses revealed that chemical plating occurred only in the laser-scanned regions,with its copper layer thickness reaching approximately 20μm and an electrical conductivity of 2.78×10^(7)S/m.Utilizing laser-induced selective metallization(LISM)technology,flexible electrodes,stretchable circuits,and map patterns were fabricated,and the molded circuits and patterns demonstrated excellent continuity and high precision.This approach provides a novel strategy for creating high-performance,high-precision metal circuits on transparent polymer substrates.
作者
刘金涛
刘新刚
周涛
LIU Jintao;LIU Xingang;ZHOU Tao(Polymer Research Institute,State Key Laboratory of Polymer Materials Engineering,Sichuan University,Chengdu 610065,China)
出处
《南京工业大学学报（自然科学版）》
CAS
北大核心
2024年第5期511-520,共10页
Journal of Nanjing Tech University(Natural Science Edition)
基金
国家自然科学基金(52103266)
四川省自然科学基金(2023NSFSC0419)。
关键词
柔性电子
激光活化
化学镀
聚酰亚胺
flexible electronics
laser activation
chemical plating
polyimide
