摘要
具有空腔结构的器件通过密封试验(俗称检漏)以确定器件封装的气密性。但在实际生产中,即使是密封检测合格的器件在进行内部水汽含量试验时,仍有一定比例的器件被检测出内部存在密封试验的示踪物质。试验结果表明,高温烘烤可以提升检漏的检出率,验证了器件出现密封检测合格、水汽含量不合格的现象是由漏孔的暂时性堵塞造成的。对水汽含量不合格的样品进行染色渗透和剖面制备,发现了外部水汽侵入器件内部的通道,提出了玻璃绝缘子和引线之间没有形成气密过渡层是造成器件漏气的主要原因,为器件的工艺改进提供了方向。
Devices with cavity structures are subjected to sealing tests(commonly known as leak detection)to determine the airtightness of the device package.However,in actual production,even if the devices that have passed the sealing test are tested for internal water vapor content,a certain proportion of the devices are still detected to have tracer substances inside for the sealing tests.The test results show that the high temperature baking can improve the detection rate of leak detection,verifying that the phenomenon of qualified seal detection and unqualified water vapor content of the device is caused by temporary blockage of the leakage holes.Dye penetration and profile preparation of the sample with unqualified water vapor content are carried out,and the channel of external water vapor intrusion into the interior of the device is found.It is pointed out that the main reason of air leakage of device is that there is no airtight transition layer between the glass insulator and the lead wire,which provides the direction for the process improvement of the device.
作者
高立
杨迪
李旭
GAO Li;YANG Di;LI Xu(China Electronics Standardization Institute,Beijing 100176,China)
出处
《电子与封装》
2024年第11期55-58,共4页
Electronics & Packaging
关键词
金属-玻璃
封装气密性
内部水汽含量
metal-glass
air tightness of package
internal water vapor content
