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大功率真空断路开关用Cu-Cr触头材料研究现状及发展 被引量:18

Present Status and Development of Research on Cu-Cr Contact Material Used in Vacuum Interrupter
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摘要 总结了CuCr合金触头材料性能、特点及其在国内外的发展现状;指出混粉烧结法、压力浸渗法的缺点;并总结了现有的改进方法,提出用喷射沉积技术生产CuCr合金触头材料。结果表明,用喷射沉积技术生产的CuCr合金触头材料中Cr颗粒进一步细化,而且均匀分布。 The present status of the development of Cu-Cr contact materials is reviewed in this paper.The disadvantages of the traditional processing techniques for these materials such as powder mixing and sintering and pressure infiltration are discussed.Based on the discussion,some possible improvement measures are proposed.and the characteristics and process for forming Cu-Cr contact materials by means of spray forming are introduced.The result shows that Cr particles in the material are further fined and uniformly dispersed in Cu matrix,which will improve the switching properties of the materials.
出处 《材料导报》 EI CAS CSCD 2002年第11期4-7,共4页 Materials Reports
基金 国家重大基础研究计划资助项目(G2000067201)
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