摘要
本文从微波组件壳体绝缘子安装孔的设计和固态焊料环的应用两方面综合考虑,制定了合理的绝缘子焊接工艺方案。X射线对绝缘子焊接的空洞率检测表明,无任何贯穿空洞并且其空洞率小于5%。按照GJB 548B-1014.2的细检条件A4,量化绝缘子焊接工艺气密性小于1×10-9Pa·m3/s;温度冲击实验后,其漏率依然小于1×10-9Pa·m3/s。与传统的焊膏焊接绝缘子相比,固态焊料环的应用以及绝缘子安装孔的设计量化了绝缘子的焊接,解决了传统焊膏焊接工艺所存在的焊料溢出、焊料空洞率高、空气腔与内导体短路等多种焊接缺陷,保证了绝缘子焊接的可靠性、气密性、一致性和美观度,提高了操作人员的效率。
A reasonable technology scheme of insulator soldering was presented,based on the consideration of insulator mounting hole design on the module shell and utilization of solid solder ring.The X-ray test on void ratio of insulator soldering shows that there exists no penetration void and the void ratio is below 5(.According to the leakage standard A4 of GJB 548B-1014.2,the air impermeability is below 1×10-9 Pa·m3/s,After multiple cycles of temperature shock tests,the air impermeability of is still below 1×10-9Pa·m3/s.In comparison with traditional insulator soldering technology using solder paste,through the utilization of solid solder ring and the design of insulator mounting hole,this new technology quantized the soldering of insulator so as to resolve the existing defects of traditional insulator soldering such as solder overflow,high void ratio and channel blocking.The quantized insulator sealed soldering technology ensured the reliability,air tightness,uniformity and beautifulness of soldering meanwhile improved operator efficiency.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2016年第4期343-346,共4页
Research & Progress of SSE
关键词
量化
焊料环
气密
焊接
微波组件
quantization
solid solder ring
hermetical seal
soldering
microwave module
