摘要
对石墨粉末的化学镀、电镀及复合镀等镀铜方法进行比较,优化出石墨粉末镀铜的最优方法,并在镀铜工艺上进行了研究,实验表明,通过采用改善石墨粉末分散性的活化剂及优化纯化剂,可提高镀铜层的厚度、连续性及镀层的耐蚀性。
The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results. The metallographic structure, oxidation resistance and electric conductivity of the copper plated graphite powder were studied and compared. The results show that the thickness, continuity and corrosion resistance of the copper plating coating on graphite powders can be improved by adding the activating agent and the purifying agent which help to enhance the dispersity of graphite powders.
出处
《炭素技术》
CAS
CSCD
2002年第5期23-25,共3页
Carbon Techniques
关键词
石墨粉末
镀铜
活化剂
导电性能
Graphite powder
copper-plating
activated agent
electric conductivity
