摘要
用树脂固化仪优选了适宜于制作弹性印章的硅橡胶的最佳固化配比 ,当固化剂B组分为 2 5 %～3 0 %时硅橡胶具有最佳的固化速度和弹性性能 ,最适于制作弹性印章。用毛细微模塑法制作了硫酸铜、苯甲酸钠等无机盐和聚酰胺酸、聚乙二醇等聚合物材料的微结构 ,并尝试了K2 CO3和CuSO4
The content of the hardener in the poly(dimethylsiloxane)(PDMS) system, which is usually used to make elastomeric stamp for “soft lithography”, is optimized by using a resin curometer. It is found that when the the content of the hardener B is between 2.5%～3.0%, the PDMS system has the optimum curing rate and the best elastic property. Stamps made from the above PDMS system were used to make microstructures by “Micromolding in Capillaries(MIMIC)” technique. Reactions occurred between K_2CO_3 and CuSO_4 in capillaries and crystallization in the limited spaces of capillary were observed. Microlines are produced from CuSO_4 and sodium benzoate, also from polyamic acid and polyethylene glycol.
出处
《应用化学》
CAS
CSCD
北大核心
2003年第1期1-5,共5页
Chinese Journal of Applied Chemistry
基金
国家自然科学基金 (2 0 1740 38)
国家杰出青年基金 (B5 992 82 0 2 )资助项目
