期刊文献+

蝶形天线增强的InP基室温HEMT太赫兹探测器研究 被引量:2

Research on InP-based HEMT terahertz detector enhanced by bow-tie antenna at room temperature
原文传递
导出
摘要 采用分子束外延技术制备了InP基HEMT样片,室温下样片迁移率达10 289 cm2/(V·s)。通过光刻、腐蚀、磁控溅射、点焊等工艺技术制备出了蝶形天线耦合的太赫兹探测器件。器件采用的蝶形天线经HFSS软件仿真优化后,天线S11参数为-40 d B,电压驻波比(VSWR)为1.15,增益可达6 dB,并与二维电子气沟道实现阻抗匹配。在VDI公司0.3 THz肖特基二极管太赫兹源辐照下进行器件测试,测试结果表明,室温下器件噪声等效功率(NEP)为40 nW/Hz1/2,探测响应度46 V/W,器件响应时间优于330μs。 InP-based HEMT samples were prepared by molecular beam epitaxy(MBE).The sample mobility at room temperature reached 10 289 cm2/(V·s).The terahertz detector coupled with a bow-tie antenna was fabricated by photolithography,etching,magnetron sputtering,spot welding.The bow-tie antenna used in the device was optimized by simulation with HFSS,so that the optimized antenna parameter of S11 was-40 dB,the voltage standing wave ratio(VSWR)was 1.15,gain was 6 d B and impedance matching with the two-dimensional electronic gas(2DEG)channel.The device was measured by VDI’s 0.3 THz Schottky diode terahertz source.The measurement results show that the device noise equivalent power(NEP)is 4 nW/Hz1/2 at room temperature,and the detection response rate is 46 V/W,the device response time is better than 330μs.
作者 李金伦 崔少辉(指导) 张静 张振伟 张博文 倪海桥 牛智川 Li Jinlun;Cui Shaohui;Zhang Jing;Zhang Zhenwei;Zhang Bowen;Ni Haiqiao;Niu Zhichuan(Department of Missile Engineering,Shijiazhuang Campus,Army Engineering University,PLA,Shijiazhuang050003,China;State Key Laboratory for Superlattices and Microstructures,Institute of Semiconductors,Chinese Academy of Sciences,Beijing100083,China;The State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology,Xidian University,Xi′an710071,China;Key Laboratory of THz Optoelectronics,Ministry of Education,Department of Physics,Capital Normal University,Beijing100048,China;Engineering Research Center for Semiconductor Integrated Technology,Institute of Semiconductors,Chinese Academy of Sciences,Beijing100083,China;College of Materials Science and Opto-Electronic Technology,University of Chinese Academy of Sciences,Beijing100049,China)
出处 《红外与激光工程》 EI CSCD 北大核心 2019年第9期132-138,共7页 Infrared and Laser Engineering
基金 国家自然科学基金(61505196) 国家重点研发计划(2018YFA0306101) 中国科学院科研仪器设备研制项目(YJKYYQ20170032)
关键词 太赫兹探测器 高电子迁移率场效应晶体管 磷化铟 蝶形天线 分子束外延 terahertz detector HEMT InP bow-tie antenna excellent beam quality
  • 相关文献

参考文献8

二级参考文献101

  • 1EMAMI S, WISER R F, ALI E, et al. A 60 GHz CMOS phased-array transceiver pair for multi-Gb/s wireless communications [ C ]//Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:164 - 165.
  • 2DEFERM N, REYNAERT P. A 120 GHz 10 Gb/s phase-modulating transmitter in 65 nm LP CMOS [ C] // Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011: 590-292.
  • 3MOMENI O, AFSHARI E. A 220-to-275 GHz traveling- wave frequency doubler with -6.6 dBm power at 244 GHz in 65nm CMOS [ C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:286 -288.
  • 4SEOKE Y, CAO C H, SHIM D H, et al. A 410GHz CMOS push-push oscillator with an on-chip patch antenna [C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2008: 472 - 473.
  • 5HUANG D, LAROCCA T R, SAMOSKA L, et al. 324 GHz CMOS frequency generator using linear superposition technique [ C] //Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2008 : 476 -477.
  • 6SENGUPTA K, HAJIMIRI A. Distributed active radiation for THz signal generation [ C ] JJ Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:288-289.
  • 7SCHUSTER F, VIDELIER H, DUPRET A, et al. A broadband THz imager in a low-cost CMOS technology [ C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA ,2011 : 42 - 43.
  • 8ABDOLLAHI-ALIBEIK S, WEBE D, DOGAN H, et al. A 65 nm dual-band 3-stream 802. 11 n MIMO WLAN SoC [C]//J Proceedings of the IEEE International Solid- State Circuits Conference. San Francisco, CA, USA, 2011: 170-172.
  • 9CHANG-TSUNG F U, LAKDAWALA H, SOUMYANATH K, et al. A 2.5 GHz 32 nm 0.35 mm^2 3.5 dB NF- 5 dBm P1dB fully differential CMOS push-pull LNA with integrated 34 dBm T/R switch and ESD protection [ C]//Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011 : 56 - 58.
  • 10TAN Y L, XU HT, EL-TANANIM A, etal. A flip- chip-packaged 1. 8 V 28 dBm class-AB power amplifier with shielded concentric transformers in 32 nm SoC CMOS [ C]// Proceedings of the IEEE International Solid-State Circuits Conference. San Francisco, CA, USA, 2011:426 -428.

共引文献48

同被引文献11

引证文献2

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部