摘要
通过用统一的粘塑性本构方程描述 SMT焊点的力学行为 ,对气孔缺陷在 SMT焊点中不同位置的情况建立二维有限元分析模型 ,并采用有限元方法分析了气孔位置对 SMT焊点疲劳寿命的影响。分析发现 ,与无缺陷焊点相比 ,气孔使焊点中应力应变分布发生了改变 ,使焊点疲劳寿命缩短 ;焊角、焊趾和焊点中部位置的气孔对焊点中的应力应变和焊点的疲劳寿命影响较小 ,而焊点根部气孔的影响则显著。
The unified viscoplastic constitutive model has been used to describe the mechanical behavior of SMT solder joint in this paper, and two dimension finite element analysis models of solder joint with gas hole of different location have also been established. The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method . Compared to the solder joint without hole, it was found that the hole will change the stress/strain distribution of the solder joint around the hole and will shorten the fatigue life of the solder joint. The effects of the hole located at solder joint top, solder joint toe and the center of solder joint on solder joint fatigue life are very small, but the effect of solder joint root on solder joint fatigue life is the greatest.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2003年第8期708-711,共4页
China Mechanical Engineering
基金
现代焊接生产技术国家重点实验室开放课题资助项目
关键词
气孔
SMT焊点
粘塑性
疲劳寿命
gas hole SMT solder joint viscoplastic fatigue life
