摘要
综述了潜伏性中湿固化环氧树脂体系的研究现状及其进展,重点地介绍了双氰胺/环氧树脂体系、咪唑/环氧树脂体系以及酸酐/环氧树脂体系的发展,以及其固化促进剂的研究进展。并在文章最后对中温固化环氧树脂体系进行了展望。
In this paper, the Present situation and the recent progress of latent moderate temperature curing epoxy resin system were introduced, especially the progress of dicyandiamide/epoxy resin system, imidazole/epoxy resin system, and acid anhydride/epoxy resin system. The promoters for the curing systems are also introduced and the development and the progress are prospected.
出处
《化学与粘合》
CAS
2003年第5期249-252,257,共5页
Chemistry and Adhesion
