摘要
通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。利用得到的焊点形态参数与热疲劳寿命的关系表达式 ,采用优化程序对基于焊点热可靠性的焊点形态进行了评价优化 ,得到了优化后的焊点形态参数。
The regression relations between the primary solder joints shape parameters and thermal fatigue life of CCGA are derived through orthogonal experiments and regressions analysis. By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes.Consequently,the optimal solder joint shape parameters are gained.
出处
《桂林电子工业学院学报》
2002年第3期31-35,共5页
Journal of Guilin Institute of Electronic Technology
