5[2]O'Neal Chad B, Malshe Ajay P. Challenges in the packaging of MEMS [ A ]. In:IEEE International Symposium on Advanced Packaging Materials [ C ]. Reston, USA, 1999.41-47.
6[3]Lee C, Parviz B A. Packaging for microelectromechanical and nanoelectromechanical systems Y [ J ]. IEEE Transactions on Advanced Packaging, 2003, 26(3 ) :217-226.
7[4]Shivkumar Bharat, Ki C J. Microrivets for MEMS packaging: Concept, fabrication, and strength testing [ J ]. Journal of Microelectromechanical Systems, 1997, 6 ( 3 ): 217-222.
8[5]Fischer Sebastian, Wilde Jürgen. Influence of materials data on the performance modelling in the design of MEMS packages [ A ]. In: IEEE International Symposium on Advanced Packaging Materials [ C ]. Atlanta, USA ,2004.57-62.
9[6]Hsieh C T, Ting Jyh-ming. The introduction of MEMS packaging technology [ A ]. In: IEEE International Symposium on Electronic Materials and Packaging [ C ]. Taiwan, China,2002. 300-306.
5[2]O'Neal Chad B, Malshe Ajay P. Challenges in the packaging of MEMS [ A ]. In:IEEE International Symposium on Advanced Packaging Materials [ C ]. Reston, USA, 1999.41-47.
6[3]Lee C, Parviz B A. Packaging for microelectromechanical and nanoelectromechanical systems Y [ J ]. IEEE Transactions on Advanced Packaging, 2003, 26(3 ) :217-226.
7[4]Shivkumar Bharat, Ki C J. Microrivets for MEMS packaging: Concept, fabrication, and strength testing [ J ]. Journal of Microelectromechanical Systems, 1997, 6 ( 3 ): 217-222.
8[5]Fischer Sebastian, Wilde Jürgen. Influence of materials data on the performance modelling in the design of MEMS packages [ A ]. In: IEEE International Symposium on Advanced Packaging Materials [ C ]. Atlanta, USA ,2004.57-62.
9[6]Hsieh C T, Ting Jyh-ming. The introduction of MEMS packaging technology [ A ]. In: IEEE International Symposium on Electronic Materials and Packaging [ C ]. Taiwan, China,2002. 300-306.
