摘要
金刚石薄膜膜基结合强度的测量与评价是其制备与应用的关键。本文根据内涨作用下薄膜发生鼓泡变形的原理 ,开发了一种新的适用于金刚石薄膜膜基结合强度定量检测的测试系统 ,并采用光刻法和湿式各向异性刻蚀技术制备得到金刚石薄膜自支撑窗口试样。采用OFV -3 0 0 0光纤激光振动仪测量薄膜鼓泡时的垂直位移 ,测量精度可以达到0 3 164 μm。通过实验实现了对硅基底金刚石薄膜结合强度的定量检测 ,实验得到的薄膜结合强度为 4 2 872 6J m2 。这种鼓泡测量法不仅适用于硅平面基底电子元器件的膜基界面结合强度的测量 ,而且还可以推广应用到硬质合金复杂形状基底的膜基界面结合强度的测量中 。
Adhesion measurement is one of the key problems for the fabrication and application of CVD diamond thin films Based on the theory of blister test, an innovative special experimental equipment adaptable for precise quantitative evaluation of the adhesive strength of diamond thin films was designed and fabricated, and free standing windows sample of diamond thin film was fabricated by photolithography and anisotropic wet etching The deflection of the film center is measured by means of a laser interferometer with a He Ne laser light source(OFV 3000, manufactured by Polytec GmbH) The displacement resolution is half the wavelength of the light, about 0 3164μm This blister test is not only adaptable to Si substrates, but also to WC Co cemented carbide substrates with complex geometries According to these test results, the adhesive strength could be obtained quantitatively by blister test, which can give a base for the applications of diamond thin films in the electron parts apparatus industry and tool industry
出处
《金刚石与磨料磨具工程》
CAS
2003年第4期1-4,共4页
Diamond & Abrasives Engineering
基金
国家自然科学基金资助项目 (50 0 0 50 1 3
50 2 750 95)
