摘要
简要综述了化学镀工艺在微电子材料中的应用,讨论了影响化学镀镍、铜、锡、钴和贵金属等的主要因素,阐述了化学镀微电子材料的特性、存在问题及研究动态。
The applications of the process of electroless plating in micro-electronic materials are briefly reviewed in this paper.Also,the effects of several main electroless platings of nickel,copper,tin,cobalt and noble metals are discussed.Properties of the electroless plating in micro-electronic materials as well as the research and development tendency are then clarified.
出处
《微纳电子技术》
CAS
2003年第5期23-27,共5页
Micronanoelectronic Technology
基金
上海市纳米科技专项基金资助课题(No.0252nm012)
