摘要
Nanocrystalline NdFeB film was fabricated onto the copper substrate through direct current electroplating method,and characterized by scanning electron microscope(SEM) coupled with energy dispersive X-ray spectroscope(EDS),vibrating sample magnetometer and potentiodynamic polarization techniques.The initial electroplating behavior was investigated by cyclic voltammetry(CV) and electrochemical impedance spectroscopy(EIS) techniques.Results revealed that the corrosion resistance of the NdFeB film was better than that of the traditional sintered NdFeB magnet.The depositing process of the NdFeB film followed the three-dimensional nucleation and subsequent grain growth mechanism,and was controlled by charger transfer.With the increase of the negative potential bias,the deposition mechanism of NdFeB film changed from heterogeneous to homogeneous nucleation/growth,which consequently resulted in the decrease of charge-transfer-resistance.
采用直流电沉积法在铜基体表面制备纳米晶NdFeB薄膜。利用扫描电镜、能谱、振动样品磁强计和动电位极化技术对样品进行表征。采用循环伏安和电化学阻抗技术对NdFeB膜电沉积初期的电化学行为进行研究。结果表明,电沉积制备的NdFeB膜的耐蚀性能优于传统烧结法制备的NdFeB膜的耐蚀性能。纳米晶NdFeB磁性薄膜的电沉积初期遵循3D瞬时成核/生长机制,电荷转移为速控步骤。随着外加沉积电位的增大,异质成核/生长逐渐转变为同质成核/生长,因此电沉积过程的电荷转移电阻减小。
基金
Project(2008BS04030)supported by Research Award Fund for Outstanding Young Scientists in Shandong Province,China
