摘要
文章分析了集成电路内缺陷成团机理及其对集成电路成品率的影响 ,应用集成电路成品率预计模型 ,分析了FPGA内缺陷成团对片内冗余容错电路可靠性的影响 ,据此提出了缺陷成团时提高FPGA片内冗余容错电路可靠性的策略 ,建立了相应的可靠性分析模型 ,给出了FPGA片内冗余容错电路布局的一些指导原则。
Mechanism of defects clustering in IC and its influence on manufacturing yield of IC are analyzed in this paper. The influence of defects clustering in FPGA on the reliability of inside fault-tolerance circuit with redundancy is also discussed by using prediction model of manufacturing yield of IC. Hereby strategies of improving its reliability are presented, model for analyzing its reliability is set up and some guidance principles about how to lay are provided.
出处
《中国空间科学技术》
EI
CSCD
北大核心
2004年第2期19-26,共8页
Chinese Space Science and Technology
