摘要
分析半导体上箱形件Housing15 3 3的工艺结构及特点 ,通过粉末注射成形工艺优化和采用研发的粘结剂系统 ,SPC技术控制注射成型工艺参数与注射件重量 ,使得烧结后所得到的箱形件Housing15 3 3产品尺寸精度 (线性公差 )达到± 0 .2 %。该工件在尺寸精度、性能等方面均满足要求。因此 ,采用粉末注射成形技术生产箱形件Housing15 3 3 ,极大地提高生产效率 ,节约材料 。
MIM is a new kind of net shape technology in manufacturing, which is applied to produce some complex parts. The MIM process of Housing1533 is analyzed. The optimization of process, self-developed binder system and SPC technology for injection molding & the weight controlling of green part are applied to the MIM process. After sintering, the linear tolerance of ±0.2% of Housing1533 is reached, and its mechanical property & precision meet with the service properties of the product. So, the MIM technology of Housing1533 can save the raw materials a great quantity and decrease cost, and the productivity is increased highly.
出处
《铸造技术》
CAS
北大核心
2004年第6期471-473,共3页
Foundry Technology
关键词
箱形件
粉末
粘结剂
注射成形
烧结
Trunk part
Powder
Binder
Injection molding
Sintering
